Future-Ready Automotive Controllers – Webinar

WHY THIS SESSION

Smaller parts. Smaller margins for error.

EV power electronics keep shrinking and getting denser. That makes hidden defects easier to miss — a hairline crack in a die-cast housing, a marginal solder joint on a PCBA, a compromised shielding layer. Conventional inspection often can’t catch these before they affect reliability, safety, or performance in the field. This session covers the non-destructive methods built to see what standard testing can’t.

WHAT THE SESSION COVERS

• Failure analysis of automotive controllers using X-Ray & CT technology
• Die-casting housing and full-dimension inspection strategies
• PCBA, connector, wiring harness & shielding layer inspection
• SiC & GaN analysis for next-generation EV power electronics
• High-resolution testing of critical computational components

SPEAKERS

Presented by EVreporter.com in association with ZEISS Industrial Quality Solutions